PCB solder mask exposure LDI exposure machine

Rigid PCB Equipment

1）Past photo film problems have led to imperfect images because they are vulnerable to temperature or humidity fluctuations.Laser images can produce more accurate and consistent images and eliminate any film related defects.
2）Laser imaging provides precise positioning and improved resolution.Image lines, space and alignment are more accurate.
3）The film method requires a temperature and humidity controlled environment in order to provide the most accurate image transmission for the image. LDI reduces the influence of the environment on the resulting image and eliminates the influence of light refraction inherent in photo processing technology.
4）LDI exposure machine is easier to realize automatic operation, saves labor cost, greatly improves product quality and avoids defective rate.

Get Price

Contact

Download

Feature

① Support dual machines connection;

② Compatible with internal and external applications;

③ It is suitable for high-speed mass production of PCB;

④ High power and low energy consumption laser source;

⑤ Support fixed expansion and contraction, automatic expansion and contraction and partition expansion and contraction.

Specification

No.	Item	Technical specification	remarks
1	Exposure machine model	ADI-ST-650
2	Table type	Single table
3	Loading and unloading methods	Manual
4	Maximum substrate size	635mm×820mm
5	Maximum exposure size	630mm×810mm
6	Minimum substrate size	200mm×170mm
7	Substrate thickness	0.075mm-5.0mm	Expandable to 8.0mm
8	Minimum resolution	35um / 35um (Hitachi rd-1215)*	Development analysis
9	Process analysis	≥50um *	More than 2.5mil is recommended for mass production
10	Depth of field	±300um
11	Line width tolerance	±10%
12	Alignment accuracy	±12um
13	Inter layer alignment accuracy	24um
14	Number of shots	6
15	Laser wave length	405nm±5nm
16	laser power	30W
17	Exposure energy adjustment range	5~2000mj
18	Energy uniformity	≥95%
19	Contraposition mode	Four point alignment and multi-point alignment
20	Grasping mode	Target, through hole, blind hole, etc
21	Data input	Gerber274D/X，ODB++
22	Expansion and contraction function	Automatic expansion and contraction, fixed expansion and contraction, measurement expansion and contraction, segmented expansion and contraction
23	capacity 620mm×510mm	10 sec / face @35mj & 3mill / S	Excluding up and down board time
23	capacity 620mm×510mm	20 sec / face @100mj & 3mill / S	Excluding up and down board time
24	MES system	Configure MES network port	Cooperative development
25	Data one click import function	have
26	safeguard	Emergency stop switch
27	Overall dimension	L2600mm×W1750mm×H1970mm
28	weight	About 4000kg

Advantages of LDI exposure machine

2）Laser imaging provides precise positioning and improved resolution.Image lines, space and alignment are more accurate.

3）The film method requires a temperature and humidity controlled environment in order to provide the most accurate image transmission for the image. LDI reduces the influence of the environment on the resulting image and eliminates the influence of light refraction inherent in photo processing technology.

4）LDI exposure machine is easier to realize automatic operation, saves labor cost, greatly improves product quality and avoids defective rate.

products

Products

Feature

Specification

Advantages of LDI exposure machine

PCB exposure machine

PCB solder mask exposure machine

Silk Screen Plate Exposure Machine