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Sweller

It is used as a mild solvent treatment agent before removing glue residue, which can bulk and soften the substrate, so as to improve the biting effect of permanganate in the next station, make the biting roughness uniform and ensure that the chemical copper plating in the later stage can be obtained very well. Good adhesion.

Neutralizer

After potassium permanganate is used to remove glue residue, it is an acidic strong reducing agent, which can neutralize the alkaline residual liquid, and at the same time remove the heptavalent manganese, hexavalent manganese and divalent manganese remaining in the hole and on the plate surface. Residues such as manganese oxide are reduced to soluble manganese ions, and oxidants are prevented from being brought into subsequent processes.

Cleaner ( Degreasing )

The cleaning agent is a slightly alkaline chemical. It mainly contains a cationic surfactant, which converts the originally negatively charged pore wall into a positive one to facilitate the adhesion of the palladium activator; on the other hand, it increases the surface tension of the pore wall. Reduced, so that the original non-hydrophilic pore wall can also have the effect of hydrophilic and moisturizing, so that the subsequent potion can play the best effect.

Pre dip agent

The main function of the presoak is to protect the activator palladium tank from bringing in too much water and impurities, and to provide chloride ions required by the activator as a sacrificial solution to maintain the stability of the palladium tank concentration.

Activator

The activator is a low-hydrochloric acid type catalyst liquid, which can provide the required palladium ions on the surface of the board and in the holes, which can supply high uniform operation efficiency without causing the multi-layer board to produce holes. With excellent stability, it can catalyze the surface of the substrate, and can combine with chemical copper in a good and meticulous state.

Accelerator

The accelerator is mainly used to peel off the tin shell deposited by the activator on the board surface and in the hole, and expose the required palladium layer, so that the chemical copper can be properly deposited.

Electroless copper

The pre-treated board can obtain an alkaline solution with metallization effect in the hole.